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        DAPE Profile
        • Dalian Asia Pacific Electronics Co., Ltd. (DAPE for short) was developed from Dalian Yingke Circuit Co., Ltd. (established in Nov.2008) As a high-tech enterprise,DAPE has become a manufacturer of multi-layer high density interconnecting printed circuit boards.
          DAPE is located in the scenic city of Dalian,in LinGang Industrial Zone, SanShiLiPu, PuWan New District, with building area more than 24,000 m². Its annual output is 700K m², out of which multi-layer accounts more than 60%.
          DAPE closely follows the development trend in digitization, integration,miniaturization,multifunction electronic products of the world,and is committed to producing PCB such as double-sided,multilayer,HDI,heavy copper power supply board,special carbon board for the high-end markets including automotive electronics,high-speed railway,industrial control,medical equipment, aerospace,military,net work communications,advanced electronics.

          Profile:
          Established on: Nov. 6th, 2013
          Land area: 17,278 ㎡ Plant area: 24,000 ㎡
          Total investment: 300.5 million RMB.
          Registered capital: 60 million RMB
          Employees: 350
          Business Domain: Development, design, manufacturing and sales of double-sided, multi-layer, HDI PCB, LED aluminum PCB, rigid & flexible PCB.
          Production capacity: 60,000m2/month (currently 30,000m2/month)
          Address: No.19,GangLong Street, LinGang Industrial Zone, SanShiLiPu, PuWan New District, Dalian, China.
        • Dalian Asia Pacific Electronics Co., Ltd. (DAPE for short) was developed from Dalian Yingke Circuit Co., Ltd. (established in Nov.2008) As a high-tech enterprise,DAPE has become a manufacturer of multi-layer high density interconnecting printed circuit boards. DAPE is located in the scenic city of Dalian,in LinGang Industrial Zone, SanShiLiPu, PuWan New District, with building area more than 24,000 m². Its annual output is 700K m², out of which multi-layer accounts more than 60%. DAPE closely follows the development trend in digitization, integration,miniaturization,multifunction electronic products of the world,and is committed to producing PCB such as double-sided,multilayer,HDI,heavy copper power supply board,special carbon board for the high-end markets including automotive electronics,high-speed railway,industrial control,medical equipment, aerospace,military,net work communications,advanced electronics. Profile: Established on: Nov. 6th, 2013 Land area: 17,278 ㎡ Plant area: 24,000 ㎡ Total investment: 300.5 million RMB. Registered capital: 60 million RMB Employees: 350 Business Domain: Development, design, manufacturing and sales of double-sided, multi-layer, HDI PCB, LED aluminum PCB, rigid & flexible PCB. Production capacity: 60,000m2/month (currently 30,000m2/month) Address: No.19,GangLong Street, LinGang Industrial Zone, SanShiLiPu, PuWan New District, Dalian, China.
        Corporate News
        Dalian Asia Pacific Electronics Co., Ltd.@ All rights reserved:ICP15006799 Design Support: Joint Assistance Add: No.19,GangLong Street,LinGang Industrial Zone,SanShiLiPu,PuWan New District,Dalian,116103,China. Tel: +86-411-39956500Fax: +86-411-39956502
        Link: Shenzhen Mingyi Electronics Co., Ltd. Contact Us On-line Message Map
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